Name: Millimeter-Wave low Noise Amplifiers (Signals and Communication Technology) (en Inglés)
Price: 235.65 EUR
Availability: InStock
Author: Mladen Božanić; Saurabh Sinha
ISBN: 9783319690193

portada Millimeter-Wave low Noise Amplifiers (Signals and Communication Technology) (en Inglés)

Formato

Libro Físico

Editorial

Springer

Autor

Mladen Božanić; Saurabh Sinha

Año

2017

Idioma

Inglés

N° páginas

334

Encuadernación

Tapa Dura

ISBN13

9783319690193

N° edición

Categorías

Cam: manufactura asistida por ordenador
Diseño asistido por ordenador (cad)

Millimeter-Wave low Noise Amplifiers (Signals and Communication Technology) (en Inglés)

Mladen Božanić; Saurabh Sinha (Autor) · Springer · Tapa Dura

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235,65 €

248,06 €

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Origen: Estados Unidos (Costos de importación incluídos en el precio)

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Reseña del libro "Millimeter-Wave low Noise Amplifiers (Signals and Communication Technology) (en Inglés)"

This book is the first standalone book that combines research into low-noise amplifiers (LNAs) with research into millimeter-wave circuits. In compiling this book, the authors have set two research objectives. The first is to bring together the research context behind millimeter-wave circuit operation and the theory of low-noise amplification. The second is to present new research in this multi-disciplinary field by dividing the common LNA configurations and typical specifications into subsystems, which are then optimized separately to suggest improvements in the current state-of-the-art designs. To achieve the second research objective, the state-of-the-art LNA configurations are discussed and the weaknesses of state-of the art configurations are considered, thus identifying research gaps. Such research gaps, among others, point towards optimization - at a systems and microelectronics level. Optimization topics include the influence of short wavelength, layout and crosstalk on LNA performance. Advanced fabrication technologies used to decrease the parasitics of passive and active devices are also explored, together with packaging technologies such as silicon-on-chip and silicon-on-package, which are proposed as alternatives to traditional IC implementation. This research outcome builds through innovation. Innovative ideas for LNA construction are explored, and alternative design methodologies are deployed, including LNA/antenna co-design or utilization of the electronic design automation in the research flow. The book also offers the authors' proposal for streamlined automated LNA design flow, which focuses on LNA as a collection of highly optimized subsystems.